EC360® NON SILICONE Thermal Pad
| Quantity | 2+ | 4+ | 8+ | 16+ | 32+ | 50+ | 100+ | 200+ | 500+ |
| Discount | 6% | 12% | 15% | 21% | 26% | 31% | 35% | 38% | 40% |
The EC360® NON SILICONE series presents silicone-free thermal conductive gap fillers with a superior price-performance ratio. Featuring a high thermal conductivity of 5.0 W/mK, these materials are ideal for applications in hard disks, optical communication, high-end industrial and medical electronics, automotive engine control equipment, and specialized telecommunications hardware. The EC360® NON SILICONE series is characterized by its very soft and highly compressible nature, natural tackiness, and excellent electrical isolation properties. These gap fillers are easy to assemble and provide reliable thermal management solutions for CPUs, heat sinks, memory modules, LED lighting, LCD-TVs, military electronics, power supplies, telecom services, wireless instruments, and automotive control services. Composed of filled acrylic elastomer, they exhibit a hardness of 60 Shore 00.
Installation Recommendation
- Clean surfaces from dirt and other possible residue.
- If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface.
- Remove one of theprotective layers and place the exposed side of the thermal pad facing the surface of the chip.
- Once positioned gently press on it to make it stick.
- Remove the second protective layer and install the heatsink.
Certificates & Datasheets