EC360® TAPE 3W/mK Thermal Adhesive
A general rule for thermal adhesive is that it either has good adhesion properties or conducts heat well. The EC360® TAPE series has its focus on thermal conductivity. Excellent thermal conduction properties make it the perfect choice for particularly challenging applications, which require a higher thermal conductivity than standard thermal tapes. It is notable however that it is not suitable for every application, like ataching very heavy heatsinks. Handling is particularly safe, as the pads are electrically isolating. The thermal adhesive is double-sided and both sides covered with a protective layer, that can be removed upon installaton. It can be easily cut using a scissor, which allows trimming it to the perfect size for any surface.
- Clean surfaces from dirt and other possible residue. If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface.
- Remove one of the protective layers and place the exposed side of the thermal adhesive facing the surface of the chip. Once positioned gently press on it to make it stick.
- Remove the second protective layer and install the heatsink.
- Wait for 1 hour for the adhesive to activate.