EC360® PCM Phase Change Material / Thermal Paste Alternative

The EC360® PCM series offers phase change material with an excellent thermal conductivity of 6.0 W/mK. It is solid at room temperature and can be easily handled during installation. The material turns from solid to liquid at around 50°C. In its liquid phase it can fill interface irregularities more efficiently than traditional thermal compounds as it adapts to the surface and takes its shape. It is the perfect replacement for all cooling systems that make use of thermal paste as a thermal compound. You can think of it as thermal paste in the shape of a pad. This means it is easier and less messy to apply than thermal paste, which makes it easier to use for beginners. Furthermore, it is more durable than thermal paste, as it does not dry out as quickly. Commong applications include CPUs, GPUs and any other cooling system that uses thermal paste as a thermal compound originally.

Installation Recommendation

• Clean surfaces from dirt and other possible residue.
• If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface.
• Remove one of theprotective layers and place the exposed side of the thermal pad facing the surface of the chip.
• Once positioned gently press on it to make it stick.
• Remove the second protective layer and install the heatsink.

Certificates & Datasheets

• Technical Datasheet (PDF)
• REACH Declararion of Conformity (PDF)
• RohS Declararion of Conformity (PDF)