EC360® GOLD SOFT 14,5W/mK Thermal pad
The EC360® GOLD SOFT series presents the intermediate variant of extra soft high-performance thermal pads, which are on eye-level with premium thermal paste. The pads have an extraordinary thermal conductivity of 14.5 W/mK and are suitable for a variety of applications.
This extra-soft variant with a low hardness of 60 Shore 00 has a putty-like consistency and is therefore highly flexible. Under pressure they will deform and adapt permanently to the surface they are applied to and will not spring back into their original shape. Examples of applications are the cooling of CPUs and GPUs (that are cooled by thermal pads), memory chips and other electrical components. They perform particularly well for water cooling systems and are easy to use. The pads are not adhesive, but stick a little, so they can be easily positioned.
It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.
Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming to the perfect size for any surface.
- Clean surfaces from dirt and other possible residue. If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface.
- Remove one of the protective layers and place the exposed side of the thermal pad facing the surface of the chip. Once positioned gently press on it to make it stick.
- Remove the second protective layer and install the heatsink.