EC360® DIAMOND 11W/mK Thermal Paste
The EC360® DIAMOND series means High Performance. State-of-the-art Nano-Graphene compounds, blended in a base of aluminium and magnesium particles, enable an outstandingly high thermal conductivity of 11W/mK.
At the same time, it can be safely applied, it is not electrically conductive, remains easy to spread and is highly durable. Low bleed, non-flowing and low evaporation mean it is long-lasting, will stay in place and not dry out over time.
- Clean surfaces from dirt and other possible residue. If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface.
- Apply the product, for example by applying a drop in the center of the chip.
- Install the heatsink. Ideally the drop should have spread now, covering the entire chip in a thin layer of thermal paste without any air bubbles.
- If the result is not satisfactory apply again in a different quantity until the desired result has been achieved.