EC360® GREEN 2,5W/mK Thermal Pad
The EC360® GREEN series presents silicone-based thermal pads for a low price, featuring a balanced thermal conductivity of 2.5 W/mK, suitable for most applications, commonly installed on memory chips and other electrical components. The perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable. Being based on silicone, they have good elasticity and compression abilities. This means this type of thermal pad will spring back into its original form even after longer periods of compression and perfectly adapt to any tiny surface irregularity.
- Clean surfaces from dirt and other possible residue. If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface.
- Remove one of the protective layers and place the exposed side of the thermal pad facing the surface of the chip. Once positioned gently press on it to make it stick.
- Remove the second protective layer and install the heatsink.