The EC360® SILVER series presents the mid-range variant of high-performance thermal pads, which are on eye-level with premium thermal pastes. The pads have a very high thermal conductivity of 12 W/mK and are suitable for a variety of applications including CPUs and GPUs (that are cooled by thermal pads), memory chips and other electrical components.
They perform particularly well for water cooling systems, as the pads have a putty like consistency, which means that they will deform and adapt permanently to the surface they are applied to and will not spring back into their original shape. The slight adhesion of the pads allows for easy positioning.
It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.
Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming to the perfect size for any surface.
- Clean surfaces from dirt and other possible residue. If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface.
- Remove one of the protective layers and place the exposed side of the thermal pad facing the surface of the chip.
- Once positioned gently press on it to make it stick.Remove the second protective layer and install the heatsink.