EC360® GREEN 2,5W/mK Thermal Pad

  • €0,79
    Einzelpreis  pro 
inkl. MwSt. zzgl. Versandkosten


The EC360® GREEN series presents the low-cost variant of our all-round silicone-based thermal pads. The thermal pads feature a balanced thermal conductivity of 2.5 W/mK and are suitable for a variety of applications.

Possible applications include RAM chips, integrated circuits and other electrical components. The pads have a rubber like consistency, which means that they will deform under pressure and spring back into their original shape. The slight adhesion of the pads allows for easy positioning.
It is the perfect solution for heat-transfer in adverse surface conditions when the use of thermal paste is unsuitable.

Handling is particularly safe, as the pads are electrically isolating and there is no risk of short-circuiting. Additionally, they can easily be cut using a scissor, which allows trimming pads to the perfect size for any surface.

Installation Recommendation

  • Clean surfaces from dirt and other possible residue. If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface.
  • Remove one of the protective layers and place the exposed side of the thermal pad facing the surface of the chip.
  • Once positioned gently press on it to make it stick.Remove the second protective layer and install the heatsink.