EC360® TAPE STRONG 1.2W/mK Thermal Adhesive
A general rule for thermal adhesive is that it either has good adhesion properties or conducts heat well. The EC360® TAPE STRONG series has its focus on adhesion.
Excellent adhesion properties make it the perfect choice for particularly difficult applications, like glueing thermal pads and even heavy heatsinks. Anything can be attached in a safe and durable way.
Handling is parcularly safe, as the pads are electrically isolang. At the same me, at 1.2 W/mK it has the best possible thermal conducvity.
The thermal adhesive is double-sided and both sides covered with a protecve layer, that can be removed upon installaon. It can be easily cut using a scissor, which allows trimming it to the perfect size for any surface.
- Clean surfaces from dirt and other possible residue. If applicable, isopropyl 90% alcohol is recommended to ensure a clean surface.
- Remove one of the protective layers and place the exposed side of the thermal adhesive facing the surface of the chip. Once positioned gently press on it to make it stick.
- Remove the second protective layer and install the heatsink.
- Wait for 1 hour for the adhesive to activate.